On one jewelry-making website, the teacher proudly displays his
jumpring–except it doesn’t look like a jumpring anymore, being
lopsided from all the solder that he used! It’s nice and smooth, but
he’ll have to grind away the excess so it won’t look blobby.
I’ve taken the opposite approach and used tiny pieces of solder on
jump rings. Heat and capillary action draw some of the solder
through the join, but the rest stays outside the join and spreads
out. It doesn’t thin out enough to be undetectable, and I don’t know
if it is due to insufficient heat, wrong flux, too much solder, too
little solder, etc.
Should I be using more solder, enough to require the use of a