I am curious about when exactly a solder should melt and flow in relation to the melt and flow point of the parent metal. It is the case for silver that the flow point of the solder is well below the solidus of sterling. Is this also the case for gold? Or does the liquidus of the solder match or exceed the solidus of the parent metal? Is this risky for melting the piece? If you have a 14K gold with a solidus of 800 degrees and liquidus of 840 can you use a solder with a flow point (liquidus) of 804 degrees?
To put it more simply, does the flow point of the solder have to remain below the solidus of the parent metal?