I need some technical advice. I have been struggling with my keum
boo applications bubbling.
Keum boo on a fabricated piece.
I soldered a small piece (a circle) of sheet fine silver over a
sterling sheet backing or base to create my design.
I then tried to bond the gold on just the fine silver surface(s)
I have found that the keum boo bubbles, and I cannot seem to get
it to bond evenly to the fine silver surfaces no matter how much I
burnish it or poke the bubbles with a pin and reheat it to burnish
the bubbles out of the surface.
What I have been told is that the keum boo on the fine silver is
bubbling because the solder has corrupted the fine silver. This is
hard to understand because only the fine silver back of the circle
was sweat soldered to the base and the fine silver surface does not
have any solder on it.
Do I bond the keum boo foil FIRST to the fine silver and THEN try
to solder it to the base pieces?
If so, what problems do I face when I do solder the gold bonded
fine silver to the base? (Bubbling? Melting? Getting absorbed by the
silver because of the heat?)
Has anyone had similar problems? If so what works for you. I see
Keum boo jewelry that has layers of silver and gold on them. They
must have been soldered at some point.