however it seems to etch very fast which is never good if you want
to avoid undercutting. Has anyone tried this with copper jewellery?
and what depth of etch can you get? I patinate the etched area with
liver of sulphur and a clear distintion between patinated
(blackened) copper and plain copper is needed, hence a the deeper
the etch the better.
I thought I should mention a couple of unintended consequences that
may flow from etching with hydrogen peroxide and hydrochloric acid.
When a mixture of hydrogen peroxide and hydrochloric acid from
printed circuit boardetching is mixed with waste acetone from cleaning
the finished board and allowed to stand, you form acetone peroxide.
While amounts obtained this way are typically much smaller than from
intentional production, they are also less pure and prepared without
cooling, hence very unstable.
So you may possibly blow yourself to smithereens. Another result
could be your arrest and imprisonment, if the authorities get the
idea you are working with these common precursors in the manufacture
So, here’s good luck to you! Now you know why I suggested the
ammonium persulphate route instead.