The 27th Santa Fe Symposium[R] Brings Together the Best Minds In the
On May 1922, 2013 jewelry professionals from around the world
attended the 27th annual Santa Fe Symposium in Albuquerque, NM. This
unique conference brings together the most respected minds in the
jewelry industry to share their research with colleagues. Topics
ranged from manufacturing solutions to jewelry trends and marketing
Santa Fe Symposium provides creative solutions to industry
challenges. The gathered leads to fewer manufacturing
defects, faster production and better products. Jewelers return year
after year to preview up-and-coming technology, to plan for future
needs as well as discover solutions that can be used immediately.
"It is the best and the only event that I can get this kind of
in such a short amount of time," says John Butler, a
research and development specialist from Stuller, Inc. who has
attended seven times. "We talked about defects in metals and there
are some things that I want to go back over and retest."
The event fosters a sense of camaraderie. Ideas are shared. New
friendships are forged. And participants leave excited to apply what
they have learned.
"I think this is one of the most fabulous events across any
industry," says Anne B. Miller, executive consultant to IBM who
presented on successful adoption of change in the workplace. "The
sharing that occurs here! The rich technical knowledge exchanged.
And the 'napkin engineering' that you see happening at the tables. I
came down last night and there were pockets of people engaged in
conversations with their iPads up and showing designs. The energy
here is exhilarating and contagious."
Santa Fe Symposium fosters a variety of timely and relevant
discussions. A vigorous debate regarding FTC guidelines, practices
and procedures for hallmarking jewelry led to a call to action for
jewelers to voice their recommendations to the FTC now while these
guidelines are being written.
Next year's Symposium will be held May 18-21, 2014, in Albuquerque,
New Mexico. For more including details on presentation
submission, sponsorship opportunities and scholarship applications,