I have been having a problem when I set an earring post onto an
Argentium backplate. I place the post with solder balled onto the end
in a third hard, loosely set so that when the solder flows the post
will lightly drop onto the backplate. I am using easy solder and just
enough heat to get the solder to flow but when it does the argenitum
backplate always slumps. Is anyone else having this problem?